10 nm premium-tier chip with integrated modem and AP
Modem
Sixth-generation LTE modem, Rel-12 Cat 16 up to 1 Gbps, 4x DL CA (80 MHz CA across four bands), 256-QAM DL, 8 × 4 DL MIMO with
CA, LTE-U/LAA, LWA
Computing performance
Qualcomm® Kryo™ 280 CPUSS: Custom 64-bit ARM v8 compliant, quad Gold + quad Silver
Qualcomm® Adreno™ 540 with 64-bit addressing, graphics APIs: OpenGL ES 3.0/3.2, DX12_FL12, Vulkan, compute APIs: OpenCL 2.0
full profile, Renderscript
Dual-channel (2 × 32) LPDDR4x (for lower-power) memory with ~30 Gbps system bandwidth
Multimedia and security
Camera: 14-bit dual ISP 28 + 16 megapixel with iHDR and zzHDR, improved I and Q and reduced camcorder power
Video decode: 4K60 8-bit VP9/H264/VP8/MPEG4 and 10-bit HEVC; video encode 4K30 HEVC/H264/VP8/MPEG4
Qualcomm® Snapdragon™ Display Engine 690 for 3840 × 2400 10-bit 60 fps + 4K60 HDMI 2.0a 10 bit or 4K30 Miracast, or DisplayPort
over USB 3.1 Gen 1 Type-C,
dual DSI 4 + 4 lane VESA DSC1.1
Hexagon DSP with second-generation programmable HVX engine to enable OEMs with differentiating camera/video features and
dedicated lower power sensor island for always-on use cases
Secure processing unit for enhanced security
Chipset
WTR5975 multiband, multimode single transceiver for up to 4x DLCA, ULCA, GNSS, LTE-U/LAA; Qlink digital interface, 40 MHz ET
PMICs with next-generation FTS buck regulators for improved power efficiency, next-generation Qualcomm® Quick Charge™ 3.0 (4.5 A),
parallel charge ( > 7 A), integrated full display power
Next-generation integrated WLAN baseband plus WCN3990 companion chip: 11ac 2 × 2 VHT80 or 1 × 1 DBS 80/40 MHz or 1 × 1 VHT160;
includes Bluetooth 5.x and FM
QCA6320(BB)/6310(RF) 11ad (WiGig 60 GHz) chip; 3 Gbps TCIP/IP aggregate peak throughput
WCD9335 native 44.1 kHz, low-power Qualcomm® Snapdragon™ Voice Activation
WCD9340/WCD9341 with enhanced DSP codec (increased memory by 1 MB) (January 2017 CS)